Package, package-on-package structure, and method of manufacturing package-on-package structure

A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second condu...

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Bibliographic Details
Main Authors CHANG, KUO-HUI, LIU, KUOIO, CHEN, CHEN-SHIEN, LAI, YI-JEN, CHEN, CHUN-JEN, CHENG, HSI-KUEI, CHIU, SHENG-HUAN, LIN, CHUNG-YI
Format Patent
LanguageChinese
English
Published 01.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns. At least one of the second conductive structures is closer to the die than the first conductive structures. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures.
Bibliography:Application Number: TW20187147317