Electronic package and manufacturing method thereof

An electronic package in which an electronic component and a passive component are arranged in a package module, and then the package module and a plurality of conductive pillars are embedded in a package layer, so there is no need to add a space for embedding the passive component in the package la...

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Bibliographic Details
Main Authors HO, CHI CHING, FU, YI MIN, PU, CHAO CHIANG
Format Patent
LanguageChinese
English
Published 11.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package in which an electronic component and a passive component are arranged in a package module, and then the package module and a plurality of conductive pillars are embedded in a package layer, so there is no need to add a space for embedding the passive component in the package layer in the subsequent process to control the space inside the package layer, and effectively reduce a volume of the electronic package.
Bibliography:Application Number: TW202110123368