Wireless module with antenna package and cap package

Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more co...

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Bibliographic Details
Main Authors DALMIA, SIDHARTH, KUSHNIR, IGAL YEHUDA
Format Patent
LanguageChinese
English
Published 11.06.2022
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
Bibliography:Application Number: TW20176113781