TWI764497B

The invention discloses a heat dissipation rubber mat carrying and laminating method and equipment. The heat dissipation rubber pad conveying method comprises the following steps of: coating a first release film on the upper surface of a heat dissipation rubber pad, and coating a second release film...

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Bibliographic Details
Main Authors WANG, XUAN-XIANG, CHENG, GUAN-LIN, WANG, AN-TIAN, KE, YOU-LIAN
Format Patent
LanguageChinese
Published 11.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a heat dissipation rubber mat carrying and laminating method and equipment. The heat dissipation rubber pad conveying method comprises the following steps of: coating a first release film on the upper surface of a heat dissipation rubber pad, and coating a second release film on the lower surface of the heat dissipation rubber pad to provide a heat dissipation rubber assembly; next, the first release film above is adhered to an adhering surface of an adhesive tape of an adhering device, so that the heat dissipation adhesive assembly is carried and conveyed in a manner that the second release film faces downwards, and the second release film is removed in the conveying process; after the heat dissipation rubber mat is attached to an attached object, the first release film is taken away from the heat dissipation rubber mat by the adhesive tape; therefore, the sheet-shaped heat dissipation rubber mat can be attached to the attached object.
Bibliography:Application Number: TW202110100809