Thermo-shaping machine for carrier board

• Main Authors: HUANG, CHUN-HAO, HUANG, CHIH-HSIEN, TAI, WENI
• Format: Patent
• Language: Chinese; English
• Published: 21.04.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A thermo-shaping machine for carrier board includes a lower die mechanism and an upper die mechanism. The lower die mechanism has a lower die unit and a first driving device. The first driving device can drive the lower die unit to move up or down for supporting the carrier board. The lower die unit provides negative pressure for sucking the carrier board. The upper die mechanism has an upper die unit, a second driving device and a plurality of heat guns. The second driving device can drive the upper die unit to move up or down for downward pressing on the carrier board, and the heat guns conveys hot air to the carrier board, so as to provide a positive pressure to thermally shape the carrier board. The hot air can recirculate by a recirculation channel. A thermal sensor is provided at an air outlet of the heat gun for controlling the temperature of the air outlet. Load cells are disposed between the upper die unit and the second driving device for monitoring the pressure force of the upper die unit. It there