TWI759881B

The invention relates to a columnar package for packaging radio-frequency chip and antenna to enhance the reading distance of the chip. The invention configures a radio-frequency chip and an antenna connected to each other on the periphery of a columnar body, and seals the radio-frequency chip and t...

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Bibliographic Details
Main Author HUANG, MENG-YAO
Format Patent
LanguageChinese
Published 01.04.2022
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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Summary:The invention relates to a columnar package for packaging radio-frequency chip and antenna to enhance the reading distance of the chip. The invention configures a radio-frequency chip and an antenna connected to each other on the periphery of a columnar body, and seals the radio-frequency chip and the antenna with an encapsulation. The antenna can be bent and has a continuous crenelated layout. The structure height formed by the layout structure of the antenna is less than the height of the main body, and the length of the wiring of the antenna is at least three times the length of the outer circumference of the main body. By the aforementioned configuration, the invention may enhance the reading distance.
Bibliography:Application Number: TW20209133415