DEVICE AND METHOD FOR REMOVING A FRAMED WAFER FROM A WAFER TRAY
A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer rec...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
21.03.2022
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Subjects | |
Online Access | Get full text |
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