DEVICE AND METHOD FOR REMOVING A FRAMED WAFER FROM A WAFER TRAY

A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer rec...

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Bibliographic Details
Main Authors AMMERL, JOSEF, FROESCHL, MICHAEL
Format Patent
LanguageChinese
English
Published 21.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer receptacle including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge. The device including a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray. Each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position to a second position.
Bibliography:Application Number: TW202110111202