Substrate processing apparatus

• Main Authors: SON, HYUK JOO, RYU, SU RYEOL, CHOI, WOO JIN, KIM, HAK DOO, PARK, YOUNG SOO, OH, JOON HO, HUR, DONG GEUN
• Format: Patent
• Language: Chinese; English
• Published: 21.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention is to provide a substrate processing device, capable of preventing a process defect due to warpage of a substrate on a stage where the substrate is processed. To this end, the substrate processing device comprises: a plurality of chambers arranged at regular intervals in a circumferential direction to process a substrate; and a turntable (600) provided to be rotated to transfer the substrate between the chambers. At least one of the chambers includes: a stage (110) where the substrate is seated; a clamp ring (120) elevated by being positioned on an upper portion of the substrate to overlap an edge of the substrate by a predetermined width in order to prevent deformation of the substrate loaded on the stage (110); an elastic member (150) provided to apply an elastic force in a direction in which the clamp ring (120) is oriented to the stage (110); and a clamp pin (160) provided to apply a force to the clamp ring (120) to resist the elastic force acting on the clamp ring (120). Accordingly