Cobalt chemistry for smooth topology and method of electrodepositing cobalt
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppress...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.03.2022
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Subjects | |
Online Access | Get full text |
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Summary: | An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm. |
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Bibliography: | Application Number: TW20209143008 |