TWI755459B

• Main Authors: EBARA, KAZUYA, SHINDO, KAZUYA
• Format: Patent
• Language: Chinese
• Published: 21.02.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A release layer production method is provided which involves a step for coating a substrate with a release layer forming composition that contains an organic solvent and at least one type of polyamic acid represented by formulas (1A) to (1C), and firing at a maximum temperature of 450-550 °C. (In the formulas, the X's independently represent tetravalent aromatic groups having two carboxylic acid derivatives, the Y's independently represent divalent aromatic groups, and Z1 and Z2 independently represent monovalent organic groups; in formula (1A), at least one of Y, Z1 and Z2 has an alkali soluble group; in formula (1B), at least one of Y and the two Z1's has an alkali soluble group; in formula (1C), at least one of Y and the two Z2's has an alkali soluble group, and the m's independently represent natural numbers.)