TWI754756B

A radiation-sensitive resin composition contains: a first polymer including a first structural unit that includes a phenolic hydroxy group, and a second structural unit that includes an acid-labile group; a second polymer including a fluorine atom, a silicon atom, or both, and including a third stru...

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Bibliographic Details
Main Author KANEKO, TETSUROU
Format Patent
LanguageChinese
Published 11.02.2022
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A radiation-sensitive resin composition contains: a first polymer including a first structural unit that includes a phenolic hydroxy group, and a second structural unit that includes an acid-labile group; a second polymer including a fluorine atom, a silicon atom, or both, and including a third structural unit that includes an alkali-labile group; a first compound that generates upon an irradiation with a radioactive ray an acid capable of dissociating the acid-labile group within 1 minute under a temperature TX° C. of no less than 80° C. and no greater than 130° C.; and a second compound that generates upon an irradiation with a radioactive ray a carboxylic acid, a sulfonic acid, or both, the carboxylic acid and the sulfonic acid each being not capable of substantially dissociating the acid-labile group within 1 minute under the temperature TX° C.
Bibliography:Application Number: TW20187119315