Method and system for vertical power devices

A method of forming a semiconductor device includes providing an engineered substrate. The engineered substrate includes a polycrystalline ceramic core, a barrier layer encapsulating the polycrystalline ceramic core, a bonding layer coupled to the barrier layer, and a substantially single crystallin...

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Bibliographic Details
Main Authors RISBUD, DILIP, ODNOBLYUDOV, VLADIMIR, AKTAS, OZGUR
Format Patent
LanguageChinese
English
Published 11.02.2022
Subjects
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