Method and system for vertical power devices
A method of forming a semiconductor device includes providing an engineered substrate. The engineered substrate includes a polycrystalline ceramic core, a barrier layer encapsulating the polycrystalline ceramic core, a bonding layer coupled to the barrier layer, and a substantially single crystallin...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
11.02.2022
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Subjects | |
Online Access | Get full text |
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