Curable composition, cured object, overcoat film and flexible wiring board and a method of manufacturing thereof

• Main Authors: YAMAMOTO, RYUNOSUKE, ISHIBASHI, YOSHITAKA, OOGA, KAZUHIKO
• Format: Patent
• Language: Chinese; English
• Published: 21.01.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible wiring board from a flexible substrate having wiring formed thereon, by coating the wiring-including surface portions of the flexible substrate with an overcoat film, the overcoat film being formed by curing the curable composition. The cured object obtained from this curable composition has a tensile modulus of 600-2,000 MPa and a tensile yield strength of 17 MPa or greater.