Metrology guided inspection sample shaping of optical inspection results
Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes f...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
21.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes from inspection measurements of a wafer. A wafer review sampling plan is generated based on the defect attributes and the modified metrology data. The wafer review sampling plan can be used during review of a wafer using the scanning electron microscope. |
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Bibliography: | Application Number: TW20187114978 |