TWI742042B

• Main Authors: YABUNO, SHINYA, ITAYA, RYO, NAKAGAWA, YASUNOBU, KAMURO, SHIGEAKI
• Format: Patent
• Language: Chinese
• Published: 11.10.2021
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The purpose of the present invention is to provide a curable resin composition from which a cured product having low tack and having excellent gas-barrier characteristic, heat resistance, and light resistance is formed. The curable resin composition includes: a component (A) which is a polyorganosiloxane represented by an average unit formula of (SiO4/2)a1(R1SiO3/2)a2(R1 2SiO2/2)a3(R1 3SiO1/2)a4 [wherein each R1 is an alkyl, an aryl, an alkenyl, or the like, the percentages of alkyl, aryl, and alkenyl with respect to the total amount of R1 are 50-98 mol%, 1-50 mol%, and 1-35 mol%, respectively, and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1 are satisfied.]; a component (B) which is a polyorganosiloxane represented by an average compositional formula of R2 mHnSiO[(4-m-n)/2] [wherein R2 is an alkyl or an aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3 are satisfied.]; and a component (C) which is a hydrosilylation catalyst.