TWI734625B

The invention relates to a multi-segment chip marking method and device, a marking device and a to-be-marked chip are prepared, the marking device is provided with a body, a multi-segment module and a marking module, the multi-segment module is provided with a processing area and at least two suppor...

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Bibliographic Details
Main Authors QIU, ZENG-MING, ZHUANG, WEN-ZHONG, ZHU, SHI-JIE
Format Patent
LanguageChinese
Published 21.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a multi-segment chip marking method and device, a marking device and a to-be-marked chip are prepared, the marking device is provided with a body, a multi-segment module and a marking module, the multi-segment module is provided with a processing area and at least two supporting groups, and the multi-segment module is provided with a processing area and at least two supporting groups. The to-be-marked chip is moved to the processing area through the supporting arms of one supporting group, the processing area and the supporting position jointly clamp the to-be-marked chip, the marking module marks the area, not shielded by the supporting arms of the supporting group, of the to-be-marked chip, and after marking is completed, the to-be-marked chip is marked by the marking module. Each supporting arm of the other supporting group of the multi-section module moves towards the processing area and abuts against the to-be-marked chip, each supporting arm of the supporting group which origina
Bibliography:Application Number: TW20209134620