TIGHT PITCH WIRINGS AND CAPACITOR(S)

The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plat...

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Bibliographic Details
Main Authors STAMPER, ANTHONY K, VAUGHN, DAISY A, HE, ZHONG-XIANG, BOSLEY, STEPHEN R
Format Patent
LanguageChinese
English
Published 01.06.2021
Subjects
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
Bibliography:Application Number: TW20198146987