Unitary molded usb device and method of fabricating the same

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

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Bibliographic Details
Main Authors GUAN, TEE KHOON, RAI, PRADEEP KUMAR
Format Patent
LanguageChinese
English
Published 11.05.2021
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Summary:A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.
Bibliography:Application Number: TW20198105040