TWI720996B

Provided is a glass cloth that can be made thin with a thickness of 14 µm or less and with which occurrences of pinholes can be suppressed when forming a thin prepreg with, for example, a thickness of 20 µm or less. The glass cloth satisfies the following (i) - (iv). (i) Degree of opening is 70 - 90...

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Bibliographic Details
Main Authors MIYAZAKI, TAKAHARU, NISHINAKA, DAISUKE, SAKITANI, KAZUTAKA, HATTORI, KOHJI, FUJII, MINORU
Format Patent
LanguageChinese
Published 11.03.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LOOMS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METHODS OF WEAVING
PRINTED CIRCUITS
TEXTILES
WEAVING
WOVEN FABRICS
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Summary:Provided is a glass cloth that can be made thin with a thickness of 14 µm or less and with which occurrences of pinholes can be suppressed when forming a thin prepreg with, for example, a thickness of 20 µm or less. The glass cloth satisfies the following (i) - (iv). (i) Degree of opening is 70 - 90% for the warp and 95 - 120% for the weft. (ii) Either the gap spacing between adjacent warps or the gap spacing between adjacent wefts is 100 µm or less. (iii) Thickness as measured according to JIS R 3420: 2013, 7.10.1 is 14 µm or less. (iv) Cloth mass measured according to JIS R 3420: 2103, 7.2 is 11 g/m2 or less.
Bibliography:Application Number: TW20165122214