Method and apparatus for forming a patterned layer of material

Methods and apparatuses for forming a patterned layer of material are disclosed. In one arrangement, a selected portion of a surface of a substrate is irradiated with electromagnetic radiation having a wavelength of less than 100 nm during a deposition process. Furthermore, an electric field control...

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Main Authors POLYAKOV, ALEXEY OLEGOVICH, MAAS, RUBEN CORNELIS, KURGANOVA, EVGENIA, VAN KAMPEN, MAARTEN, VORONINA, VICTORIA, DOLGOV, ALEXANDR, WUISTER, SANDER FREDERIK, KASTRUP, BERNARDO, VAN LARE, MARIE-CLAIRE, DRUZHININA, TAMARA, DE JAGER, PIETER WILLEM HERMAN, OVERKAMP, JIM VINCENT
Format Patent
LanguageChinese
English
Published 01.01.2021
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Methods and apparatuses for forming a patterned layer of material are disclosed. In one arrangement, a selected portion of a surface of a substrate is irradiated with electromagnetic radiation having a wavelength of less than 100 nm during a deposition process. Furthermore, an electric field controller is configured to apply an electric field that is oriented so as to force secondary electrons away from the substrate. The irradiation locally drives the deposition process in the selected portion and thereby causes the deposition process to, for example, form a layer of material in a pattern defined by the selected portion.
Bibliography:Application Number: TW20198106798