Methods for processing semiconductor wafers having a polycrystalline finish

A method of polishing a semiconductor wafer comprises a comparison of an initial wafer profile to a post-polishing wafer profile to determine variations between the profiles, and one of the center area and the edge area of the polishing pad surface is dressed based on the variations between the init...

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Bibliographic Details
Main Authors ZHANG, GUOQIANG D, CROOKS, MARK S, RAGAN, TRACY M
Format Patent
LanguageChinese
English
Published 01.01.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of polishing a semiconductor wafer comprises a comparison of an initial wafer profile to a post-polishing wafer profile to determine variations between the profiles, and one of the center area and the edge area of the polishing pad surface is dressed based on the variations between the initial wafer and the post-polishing wafer profiles.
Bibliography:Application Number: TW20165116794