TWI713684B

• Main Authors: TAMURA, KOKI, YOSHIOKA, TAKAHIRO, MASUJIMA, MASAHIRO, IMAI, HIROFUMI
• Format: Patent
• Language: Chinese
• Published: 21.12.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

The present invention provides an adhesive composition, as an adhesive composition for use in a laminate for forming a plug by fan-out type technology, which has high chemical resistance and is capable of forming an adhesive layer capable of maintaining high viscoelasticity at a high temperature. Th...