TWI713684B

The present invention provides an adhesive composition, as an adhesive composition for use in a laminate for forming a plug by fan-out type technology, which has high chemical resistance and is capable of forming an adhesive layer capable of maintaining high viscoelasticity at a high temperature. Th...

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Bibliographic Details
Main Authors TAMURA, KOKI, YOSHIOKA, TAKAHIRO, MASUJIMA, MASAHIRO, IMAI, HIROFUMI
Format Patent
LanguageChinese
Published 21.12.2020
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides an adhesive composition, as an adhesive composition for use in a laminate for forming a plug by fan-out type technology, which has high chemical resistance and is capable of forming an adhesive layer capable of maintaining high viscoelasticity at a high temperature. The adhesive composition, in the adhesive composition configured by interposing and laminating the adhesive layer on a support body for supporting the plug, comprises the plug comprising a wire layer on which an element is mounted, the element, and the plug for encapsulating the element, and comprises a block copolymer, a polymerizable monomer, and a polymerization initiator as an adhesive composition for forming the adhesive layer.
Bibliography:Application Number: TW20176102973