Computational metrology based correction and control

A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selec...

Full description

Saved in:
Bibliographic Details
Main Authors GROUWSTRA, CEDRIC DESIRE, CHEN, CHANG-WEI, LAMBREGTS, CORNELIS JOHANNES HENRICUS, TEL, WIM TJIBBO, NIEN, CHI-FEI, SMORENBERG, PIETER GERARDUS JACOBUS, RIJPSTRA, MANOUK, KOU, WEITIAN, ROY, SARATHI
Format Patent
LanguageChinese
English
Published 21.11.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CALCULATING
CINEMATOGRAPHY
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTROGRAPHY
HOLOGRAPHY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MATERIALS THEREFOR
MEASURING
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.
Bibliography:Application Number: TW20187144818