Photosensitive resin composition and photo-cured pattern prepared from the same

The invention provides a photosensitive resin composition with improved chemical resistance of solvents and developing property and a photocuring pattern made thereof. The invention relates to a photosensitive resin composition and a photocuring pattern made thereof. More specifically, the invention...

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Bibliographic Details
Main Authors AHN, BO EUN, CHUN, JI MIN, KIM, SEONG BEEN
Format Patent
LanguageChinese
English
Published 21.11.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:The invention provides a photosensitive resin composition with improved chemical resistance of solvents and developing property and a photocuring pattern made thereof. The invention relates to a photosensitive resin composition and a photocuring pattern made thereof. More specifically, the invention relates to a photosensitive resin composition and a photocuring pattern made thereof, and the photosensitive resin composition comprises alkali soluble resin, a polymerized compound, a photopolymerization initiating agent, and a solvent, wherein the polymerized compound comprises a compound represented by a chemical formula 1 and a compound represented by a chemical formula 2. Therefore, the chemical resistance of the solvents and the developing property can be simultaneously improved.
Bibliography:Application Number: TW20176129980