Method of manufacturing semiconductor device, and semiconductor device

A production method for a semiconductor device, the production method including: a preparation step for preparing a semiconductor wafer that has a circuit formed on a principal surface thereof; an attachment step for attaching the semiconductor wafer to an adhesive layer; a first division step for o...

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Bibliographic Details
Main Author MORI, HIRONARI
Format Patent
LanguageChinese
English
Published 11.11.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A production method for a semiconductor device, the production method including: a preparation step for preparing a semiconductor wafer that has a circuit formed on a principal surface thereof; an attachment step for attaching the semiconductor wafer to an adhesive layer; a first division step for obtaining a plurality of semiconductor chips by dividing, in accordance with dicing regions, the semiconductor wafer that has been attached to the adhesive layer; a sealing step for collectively sealing the plurality of semiconductor chips, which have the principal surface thereof attached to the adhesive layer, such that a sealing material layer that comprises a semiconductor sealing resin composition is formed in the intervals between the side surfaces of the semiconductor chips and on the rear surface of the semiconductor chips; and a second division step for obtaining a plurality of semiconductor chips that have the sealing material layer formed on the side surfaces and rear surface thereof by dividing the seali
Bibliography:Application Number: TW20154127817