TWI704581B

Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermos...

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Main Authors ITOU, MASAHIRO, ISHIZAWA, HIDEAKI, SADANAGA, SHUUJIROU, NAGATA, MAI, KUBOTA, TAKASHI
Format Patent
LanguageChinese
Published 11.09.2020
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermosetting component, and when difference scanning calorimetry is performed by heating the conductive particles and the thermosetting component at a temperature increase rate of 25-10°C/min, a temperature region indicating an endothermic peak derived from melting of the solder in the conductive particles and a temperature region indicating a exothermic peak derived from curing of the thermosetting component at least partially overlap each other.
Bibliography:Application Number: TW20165127115