TWI697981B
The subject of the present invention is to provide a die bonding apparatus having a means for detecting an abnormality of a bonding head and the like. To solve the problem, the die bonding apparatus includes a die supply part, a substrate supply part, a bonding part for bonding a die supplied from t...
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| Main Author | |
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| Format | Patent |
| Language | Chinese |
| Published |
01.07.2020
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The subject of the present invention is to provide a die bonding apparatus having a means for detecting an abnormality of a bonding head and the like. To solve the problem, the die bonding apparatus includes a die supply part, a substrate supply part, a bonding part for bonding a die supplied from the die supply part onto a substrate supplied from the substrate supply part or onto a die already bonded to the substrate, and a control unit for controlling the die supply part, the substrate supply part and the bonding part. The bonding part includes a bonding head having a chuck for attracting the die, a driving unit having a driving shaft for moving the bonding head, and a sensor capable of detecting an angular velocity and an acceleration of the bonding head. Based on the result obtained by the sensor, the control unit compares a vibration displacement with a predetermined threshold value of vibration displacement to determine an abnormality. |
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| Bibliography: | Application Number: TW20187129890 |