Semiconductor package device and method of manufacturing the same

An image sensor comprises a chip, a first redistribution layer (RDL), a second RDL and a third RDL. The chip has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first RDL is disposed on the first su...

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Bibliographic Details
Main Author TSENG, CHI SHENG
Format Patent
LanguageChinese
English
Published 11.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An image sensor comprises a chip, a first redistribution layer (RDL), a second RDL and a third RDL. The chip has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first RDL is disposed on the first surface of the chip and extends along the first surface of the chip and beyond the lateral surface of the chip. The second RDL is disposed on the second surface of the chip. The third RDL is disposed on the lateral surface of the chip and connects the first RDL to the second RDL.
Bibliography:Application Number: TW20187104419