Agitating device of electroplating system

The invention discloses a stirring device of an electroplating system. The electroplating system is provided with a tank body, wherein the box body is provided with a bottom wall and a plurality of side walls erected on the bottom wall, the bottom wall and the plurality of side walls are encircled t...

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Bibliographic Details
Main Authors SUN, SHANG-PEI, HSU, CHIANG, WU, PO-HSUAN, HUANG, BO-SYUAN, CHENG, WEN-FENG
Format Patent
LanguageChinese
English
Published 01.05.2020
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The invention discloses a stirring device of an electroplating system. The electroplating system is provided with a tank body, wherein the box body is provided with a bottom wall and a plurality of side walls erected on the bottom wall, the bottom wall and the plurality of side walls are encircled to form a space for accommodating electroplating liquid and an object to be plated. The stirring device at least comprises a gas conduit and two water outlet pipes, the gas conduit is provided with a gas ejection area, each water outlet pipe is provided with a liquid spraying area, the gas spraying area and the liquid spraying areas are arranged below the object to be plated, and the gas spraying area is overlapped with the object to be plated. The liquid spraying areas of the two water outlet pipes are located on the two outer sides of the gas spraying area respectively. The gas spraying area is used for spraying gas and centralizing the gas under the object to be plated, meanwhile, disturbance is caused by liquid
Bibliography:Application Number: TW20187123005