Carrier for temporary bonded wafers

A carrier is disclosed onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a foil, a sheet or a plate. The plate shaped laminate comprises a second layer comprising a porous metal me...

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Bibliographic Details
Main Authors DE BAERDEMAEKER, JEREMIE, GOOSSENS, DAVY
Format Patent
LanguageChinese
English
Published 21.02.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A carrier is disclosed onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a foil, a sheet or a plate. The plate shaped laminate comprises a second layer comprising a porous metal medium with three- dimensional open pores. The porous metal medium comprises metal fibers. The first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located. The porous metal medium comprises a first porous layer and a second porous layer. The first porous layer is provided between the first layer and the second porous layer. The porosity of the first porous layer is higher than the porosity of the second porous layer.
Bibliography:Application Number: TW20165106524