Wiring substrate and method for manufacturing wiring substrate

A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plati...

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Bibliographic Details
Main Author ROKUGAWA, TAKAHIRO
Format Patent
LanguageChinese
English
Published 21.12.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plating layer. The metal plating layer has a size that is the same as that of the seed layer in a plan view. The metal posts each include an upper end, which projects from the protective layer, and a lower end, which has a width that is the same as that of the upper end or greater. The protective layer includes a fillet for each metal post. The fillet extends toward an upper end surface of the corresponding metal post and contacts a side surface of the corresponding metal posts.
Bibliography:Application Number: TW20154121259