POLISHING PAD
The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically distributed outwardly from the center of the polishing surface with a predetermined spacing, wherein the first grooves in a half of the polis...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
11.12.2019
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Subjects | |
Online Access | Get full text |
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Abstract | The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically distributed outwardly from the center of the polishing surface with a predetermined spacing, wherein the first grooves in a half of the polishing surface and the first grooves in the other half of the polishing surface are in staggered arrangement, and multiple arc-shaped second grooves are in spiral arrangement in the polishing surface with a predetermined spiral pitch. The second grooves intersect respectively with the first grooves. |
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AbstractList | The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically distributed outwardly from the center of the polishing surface with a predetermined spacing, wherein the first grooves in a half of the polishing surface and the first grooves in the other half of the polishing surface are in staggered arrangement, and multiple arc-shaped second grooves are in spiral arrangement in the polishing surface with a predetermined spiral pitch. The second grooves intersect respectively with the first grooves. |
Author | HSU, JING-WANG HSU, SHIHIEH |
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Notes | Application Number: TW20198100042 |
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RelatedCompanies | POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION |
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Snippet | The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically... |
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SubjectTerms | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
Title | POLISHING PAD |
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