POLISHING PAD

The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically distributed outwardly from the center of the polishing surface with a predetermined spacing, wherein the first grooves in a half of the polis...

Full description

Saved in:
Bibliographic Details
Main Authors HSU, SHIHIEH, HSU, JING-WANG
Format Patent
LanguageChinese
English
Published 11.12.2019
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The present application provides a polishing pad, including a circular polishing surface and multiple semicircular arc-shaped first grooves are concentrically distributed outwardly from the center of the polishing surface with a predetermined spacing, wherein the first grooves in a half of the polishing surface and the first grooves in the other half of the polishing surface are in staggered arrangement, and multiple arc-shaped second grooves are in spiral arrangement in the polishing surface with a predetermined spiral pitch. The second grooves intersect respectively with the first grooves.
Bibliography:Application Number: TW20198100042