Encapsulation film
The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.12.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device. |
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Bibliography: | Application Number: TW20187120069 |