Stripping apparatus

To reduce the time taken to acquire the positional information of a semiconductor chip W.SOLUTION: An imaging device 1 includes: an area camera 80 for imaging a region with a first area of a sheet S, to which a plurality of semiconductor chips W are attached; a supporting tool movement mechanism 21...

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Bibliographic Details
Main Authors SHIMADA, RYOJI, ISHII, SUSUMU
Format Patent
LanguageChinese
English
Published 01.11.2019
Subjects
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES
PACKING
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
STORING
TRANSPORTING
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Summary:To reduce the time taken to acquire the positional information of a semiconductor chip W.SOLUTION: An imaging device 1 includes: an area camera 80 for imaging a region with a first area of a sheet S, to which a plurality of semiconductor chips W are attached; a supporting tool movement mechanism 21 for moving a sheet supporting tool 2 supporting the sheet S with respect to the area camera 80; a removal mechanism 3 for removing the semiconductor chip W based on the positional information of the semiconductor chip W acquired by imaging the semiconductor chip W by the area camera 80; and a line scanner camera 70 for imaging a region with a second area of the sheet S, the second area being larger than the first area. The supporting tool movement mechanism 21 relatively moves the sheet supporting tool 2 supporting the sheet S with respect to the area camera 80 according to existence information on the presence or absence of the semiconductor chip W on the sheet S acquired by imaging the semiconductor chip W by the
Bibliography:Application Number: TW20198105514