ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This invention provides an electronic package and a manufacturing method thereof, in which an electronic component and a conductive structure having a sensing region are embedded in an insulator; the sensing region is exposed outside the insulator; the electronic component and the conductive structu...

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Bibliographic Details
Main Author HO, CHI CHING
Format Patent
LanguageChinese
English
Published 01.10.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This invention provides an electronic package and a manufacturing method thereof, in which an electronic component and a conductive structure having a sensing region are embedded in an insulator; the sensing region is exposed outside the insulator; the electronic component and the conductive structure are electrically connected by a line structure; and then a trench of a board body is further disposed on the sensing region of the electronic component.
Bibliography:Application Number: TW20187133854