TWI672356B

• Main Authors: SHIMOKAWA, DAISUKE, HIRAYAMA, TAKAMASA, NISHIO, AKINORI
• Format: Patent
• Language: Chinese
• Published: 21.09.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MINERAL OR SLAG WOOL; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; USE OF MATERIALS AS ADHESIVES

To provide an adhesive sheet of a heat peeling type (heat peelable adhesive sheet) having an adhesive layer into which chemical solution hardly infiltrates. The heat peelable adhesive sheet includes afirst adhesive layer, a base material, and a second adhesive layer in this order. The first adhesive layer includes an acrylic adhesive including a (meth)acrylic polymer and a thermal-expandable microsphere. The (meth)acrylic polymer includes: a constitutional unit derived from a (meth)alkyl acrylate ester having an alkyl group with two or more carbon atoms; and a constitutional unit derived froma (meth)acrylic monomer having an OH group. In the (meth)acrylic polymer, a molar ratio (C/OH) of carbon (C) in a side chain alkyl group and the OH group is 40-150.