Cover tape for electronic component packaging and package for electronic component

This cover tape for electronic component packaging comprises: a base layer; a sealant layer that is provided on one surface of the base layer; and an antistatic layer that is provided on a surface of the base layer, said surface being on the reverse side of the above-described one surface. If R50 is...

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Bibliographic Details
Main Author MORITOH, RYOSUKE
Format Patent
LanguageChinese
English
Published 21.06.2019
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
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Summary:This cover tape for electronic component packaging comprises: a base layer; a sealant layer that is provided on one surface of the base layer; and an antistatic layer that is provided on a surface of the base layer, said surface being on the reverse side of the above-described one surface. If R50 is the surface resistivity of the surface of the antistatic layer as measured at 23°C at 50% RH and R30 is the surface resistivity of the surface of the antistatic layer as measured at 23°C at 30% RH, the value of R50/R30 is from 0.35 to 2.8 (inclusive).
Bibliography:Application Number: TW20165106827