Thin film encapsulation processing system and process kit
The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). In one embodiment a process kit for use in an atomic layer deposition (ALD) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). In one embodiment a process kit for use in an atomic layer deposition (ALD) chamber is disclosed and includes a dielectric window, a sealing frame, and a mask frame connected with the sealing frame, wherein the mask frame has a gas inlet channel and a gas outlet channel formed therein on opposing sides thereof. |
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Bibliography: | Application Number: TW20176142418 |