TWI658116B

• Main Authors: AKIYAMA, SEIJI, MORINO, AKINORI
• Format: Patent
• Language: Chinese
• Published: 01.05.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DISPOSAL OF SOLID WASTE; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; RECLAMATION OF CONTAMINED SOIL SOIL; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

An object of the present invention is to provide an adhesive tape that has very good adhesion in a temperature range of not greater than 60° C. and that rapidly decreases its adhesion after heating for a short period of time. The invention relates to an adhesive tape including a rubber-based adhesiv...