TWI658116B

An object of the present invention is to provide an adhesive tape that has very good adhesion in a temperature range of not greater than 60° C. and that rapidly decreases its adhesion after heating for a short period of time. The invention relates to an adhesive tape including a rubber-based adhesiv...

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Bibliographic Details
Main Authors AKIYAMA, SEIJI, MORINO, AKINORI
Format Patent
LanguageChinese
Published 01.05.2019
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DISPOSAL OF SOLID WASTE
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
RECLAMATION OF CONTAMINED SOIL SOIL
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:An object of the present invention is to provide an adhesive tape that has very good adhesion in a temperature range of not greater than 60° C. and that rapidly decreases its adhesion after heating for a short period of time. The invention relates to an adhesive tape including a rubber-based adhesive layer. The storage modulus G120 of the adhesive component present in the adhesive layer at 120° C. is 1.0×103 to 2.0×105 Pa. The ratio (G23/G120) of the storage modulus G23 of the adhesive component at 23° C. to the storage modulus G120 is 1 to 20.
Bibliography:Application Number: TW20154121246