Electronic sensor supported on rigid substrate

A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so a...

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Bibliographic Details
Main Authors FRED G, BENKLEY, DAVID RODNEY, BAKER, DAVID N, LIGHT, THOMAS, GAUDETTE
Format Patent
LanguageChinese
English
Published 11.01.2019
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.
Bibliography:Application Number: TW20165137772