Semiconductor processing system and method
A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respecti...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
11.11.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively. Based on the plurality of temperature measurements, a controller is adapted to determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer. |
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Bibliography: | Application Number: TW20140145701 |