Conductive composition for printing thin film and method of forming thin film conductive pattern

• Main Authors: WAKABAYASHI, SHOICHIRO, ONO, TAKAHIKO, UCHIDA, HIROSHI, KURITANI, MASUMI, DOU, JUN
• Format: Patent
• Language: Chinese; English
• Published: 11.10.2018
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS THEREFOR; WOODSTAINS

Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300°C or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25°C being 1.0×10 3 to 2×10 5 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sinteri