Superspeed inter-chip communications

An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY int...

Full description

Saved in:
Bibliographic Details
Main Authors CHELLAPPAN, SATHEESH, HARRIMAN, DAVID, RANGANATHAN, SRIDHARAN, VADIVELU, KARTHI R, SARWAR, ZEESHAN, MUKKER, ANOOP, SHARMA, SHALINI
Format Patent
LanguageChinese
English
Published 01.10.2018
Subjects
CALCULATING
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
PHYSICS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Online AccessGet full text

Cover

More Information
Summary:An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
Bibliography:Application Number: TW20150124066