Semiconductor package structure and semiconductor process

The semiconductor package includes a substrate, a plurality of components, an interposer, an electrical interconnect and a first package body. The substrate has a first surface and a second surface opposite to the first surface. A first component is mounted on the first surface of the substrate, and...

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Bibliographic Details
Main Authors LIN, CHENG NAN, LEE, MING CHIANG, LIAO, KUO HSIEN
Format Patent
LanguageChinese
English
Published 21.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The semiconductor package includes a substrate, a plurality of components, an interposer, an electrical interconnect and a first package body. The substrate has a first surface and a second surface opposite to the first surface. A first component is mounted on the first surface of the substrate, and a second component is mounted on the second surface of the substrate. The interposer has a first surface. The electrical interconnect connects the first surface of the interposer to the second surface of the substrate. The first package body is disposed on the second surface of the substrate and encapsulates the second component, the electrical interconnect and at least a portion of the interposer.
Bibliography:Application Number: TW20154134577