FABRIC HAVING MULTIPLE LAYERED CIRCUIT THEREON INTEGRATING WITH ELECTRONIC DEVICES

• Main Authors: CHEN, CHIEN CHENG, RWEI, SYANG PENG, CHOU, TZU WEI, SUNG, GUO MING
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, ORYARNS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOOMS; MECHANICAL FINISHING OF YARNS OR ROPES; METHODS OF WEAVING; SEMICONDUCTOR DEVICES; TEXTILES; WARPING OR BEAMING; WEAVING; WOVEN FABRICS; YARNS; YARNS OR THREADS

The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).