Stacked coil structure and manufacturing method thereof

• Main Authors: CHEN, CHIEH-YEN, WANG, CHUEI-TANG, TANG, TZUUN, TSENG, MING-HUNG, TSAI, HAO-YI, KUO, HUNG-YI, YU, CHEN-HUA
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRICITY; GENERATION; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SYSTEMS FOR STORING ELECTRIC ENERGY; TRANSFORMERS

A structure includes a first encapsulating layer, and a first coil in the first encapsulating layer. A top surface of the first encapsulating layer is coplanar with a top surface of the first coil, and a bottom surface of the first encapsulating layer is coplanar with a bottom surface of the first coil. A second encapsulating layer is over the first encapsulating layer. A conductive via is in the second encapsulating layer, and the first conductive via is electrically coupled to the first coil. A third encapsulating layer is over the second encapsulating layer. A second coil is in the third encapsulating layer. A top surface of the third encapsulating layer is coplanar with a top surface of the second coil, and a bottom surface of the third encapsulating layer is coplanar with a bottom surface of the second coil.